+91 9356097267, +91 9356083894
admissions.mit@mit.asia
MIT Magazine
Toggle navigation
Home
About Us
Parent Trust
About Institute
Director's Message
Principal's Desk
Infrastructure
Academics
Programmes Offered
Departments
Architecture
Civil Engineering
Computer Science and Engineering
Electrical Engineering
Electronics and Telecommunication Engineering
Mechanical Engineering
Computer Applications
Admission
Admission and Fees
Admission FAQ's
Enquiry Form
Admission Process Information
Scholarships offered by MIT
Information regarding Govt. Scholarships
Documents Required for Admission
Placement
About T&P Cell
Placement Records
In Plant Training
Trainings & Activities
Contact T&P Cell
Research
Research and Innovation
Industry Institute Interaction Wing
Faculty Research Profile
Student Corner
Alumni
Contact Us
Home
About Us
Parent Trust
About Institute
Director's Message
Principal's Desk
Infrastructure
Acadamic
Program Offerd
Departments
Architecture
Civil Engineering
Computer Science and Engineering
Electrical Engineering
Electronics and Telecommunication Engineering
Mechanical Engineering
Computer Applications
Admission
Admission and Fees
Admission FAQ's
Enquiry Form
Admission Process Information
Scholarships offered by MIT
Information regarding Govt. Scholarships
Documents Required for Admission
Placement
About T&P Cell
Placement Records
IPT Records
Trainings & Activities
Contact T&P Cell
Research
Research and Innovation
Industry Institute Interaction Wing
Faculty Research Profile
Student Corner
Alumni
Contact Us
Placement Records
About T&P Cell
Policy
Placement Process
Recruiters
Placement Record
Inplant Training
FAQ's
Contact T&P Cell
Year wise Placement Records
Year
Placements 2021-22
View
Placements 2020-21
View
Placements 2019-20
View
Placements 2018-19
View
Placements 2017-18
View
Placements 2016-17
View
Placements 2015-16
View